| Technical specifications 技术规格 |
| 材料 Material |
聚酰亚胺 polyimide |
备注及测试方法
Remarks and Testing Technique |
| 层数Layers |
1-6层
1-6layers |
|
| 最小线宽线距 Min trace width/spaca |
0.075mm(3mil) |
|
| 最小成品板厚 Min finished board thickness |
单面(single):0.07mm |
|
| 双面(double):0.125mm |
| 四层(4layer):18mm 以上 |
最小成品孔铜
Min finished hole wall copper thickness |
双层(double):12mm以上 |
|
| 四层(4layer):18mm 以上 |
| Pi膜厚度PI thickness |
12.7um、25.4um |
|
| 基本铜厚Copper thickness |
12um、18um 、35um |
|
最小孔径
Min hole diameter |
钻孔 Drillingg |
Ф0.15mm |
|
| 冲孔 Punching |
Ф0.50mm |
| 尺寸公差Dimension Tolerance |
导线宽度 Trace width |
±10% |
W≤0.5mm |
| 孔径 Hole diameter |
±0.05mm |
H≤1.5mm |
| 孔位 Lolcation of hole |
±0.05mm |
|
| 外形公差Outline dimension |
±0.1mm |
L≤50mm |
| 导线和外线Conductors and outline |
±0.075mm |
C≤5.6mm |
| 表面处理Surface Treatment |
Ni/Au Plating镀镍金 |
|
| Immersion gold 沉镍金 |
| Pure-tin Plating 镀纯锡 |
| 抗弯折次数 Withstanding bending times |
多层分层板动态弯折10万次以 上(选用10um纯胶);非动态变折 依GB/T13557执行(单面15Q以 上,双面40次以上) |
|
| 绝缘电阻 Insulation resistance |
湿热处理后电阻≥10M5Ω |
|
| 耐电压测试 Withstanding voltage |
AC500V 无击穿火花 |
|
| 热应力测试 Thermal stress test |
288℃/10秒 |
|
| 剥离强度 Peeling strength |
1.0Kgf/cm |
IPC-TM-650 |
外观通用接受标准
Accepted standard of apperance |
|
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